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  • PCB Manufacturing

At eRio Circuits, we specialize in PCB manufacturing with a commitment to quality and precision. Our state-of-the-art facilities and advanced manufacturing processes ensure that every board meets the highest industry standards. From single-layer to multi-layer PCBs, we offer a comprehensive range of manufacturing services to meet your specific needs.

With fast turnaround times and rigorous quality control measures, you can trust eRio Circuits for reliable and efficient PCB manufacturing. Partner with us for your next project and experience the difference that quality and expertise can make in bringing your designs to life.

  • PCB Manufacturing

Why Choose Our PCB Manufacturing

With a commitment to fast turnaround times and rigorous quality control measures, we guarantee reliable and efficient manufacturing services. Whether you need single-layer or multi-layer PCBs, trust eRio Circuits to deliver products that meet the highest industry standards.

Single Layer

Double layer

Multilayer

Aluminium PCB

Rigid, Flex, Flex-rigid

  • PCB Manufacturing Technical Capabilities

Technical Capabilities

Specification Value
Maximum no. of Layers 16
Maximum Board Thickness 3.2
Minimum Finished Board Thickness 0.20 (No HAL / Masking)

Maximum Board Size(L x W)

Material Value
FR4 430 x 585 mm
Roger 435 x 275 mm

Circuit Layers (All values are in mm)

Specification Minimum Track Width Minimum Spacing
For Start Copper Thickness of 0.5 Oz. For Outer Layer 0.1 0.1
For Start Copper Thickness of 1.0 Oz. 0.1 0.1
For Start Copper Thickness of 2.0 Oz. 0.175 0.2

Base Materials

Specification Value
Base Material FR4
Max. Cu Wt. For Planes (Oz.) 2
Max. Cu Wt. For Signals (Oz.) 2
Min. Cu Wt. (Oz.) 0.5

Drilling (All values are in mm)

Specification Value
Minimum Finished via Hole Size 0.1
Minimum via Pad Size
Outer Layers 0.4
Inner Layers 0.4
Minimum Annular Ring 0.1
Drill to Drill Clearance 0.15
Minimum Slot Size For PTH Slots (Tool size) 0.5
Blind & Buried vias Manufacturable Yes
Drill to Track Clearance For Inner Layers (upto 6 layer) 0.2
Drill to Track Clearance for Inner Layers (>6 layer) 0.2
Minimum Drill Size For Plated Holes on Board Edge 0.6
Minimum Drill to Drill Clearance For Plated Holes on Board Edge 0.2

Surface Finish

  • HASL, HASL PB Free
  • Immersion Gold/Tin/Silver
  • Gold Finger Plating
  • OSP, Immersion Gold + OSP

Special Processing

  • Buried And blind vias
  • Via In Pad
  • Impedance control
  • stepped golden
  • golden fingers

Solder Mask Colours

  • Green
  • Black
  • White
  • Blue
  • Red
  • Other Services